We provide support for improving the functionality of glass and quartz materials.
Quartz glass is used for module products such as flat panels, precision parts for semiconductor manufacturing equipment, and masks (ArF, EUV, etc.).
Since quartz glass and other materials are required to have higher functionality, more sophisticated and diversified analysis than before is required.
We propose the analysis required for this high functionality, such as analysis of very small amount of contaminants and impurities, evaluation of shape and surface roughness, thermophysical properties, measurement of various physical properties for crack and defect control.
Test Items
We provide support for various items for each raw material or product, ranging from impurity analysis to flaw/foreign matter analysis, and evaluation of optical characteristics and properties, etc.
| Analysis item | Technique, Equipment | |
|---|---|---|
| Composition・Impurity | Elemental analysis-Soluble components | ICP-MS, ICP-AES, AAS, Steam distillation-IC |
| Elemental analysis-Insoluble component | LIBS, EPMA, TOF-SIMS, XPS, XRF | |
| Elemental analysis-Volatile components | ND-IR, Conbustion-IC | |
| Structure analysis | Crystalline | XRD, High temperature XRD |
| Valence | Solid-NMR, XPS, ESR, XAFS | |
| Powder characteristics | Specific surface area, Particle size distribution, Fluidity, Jet flow characteristics | Nitrogen adsorption method, Mercury press-in method, Blaine air permeation method, Laser diffraction method,gravity/centrifuge settling method, Electric resistance method |
| Solubility | - | Solubility testing、Hansen solubility parameter(Dissolution) |
| Composition・Impurity | Elemental analysis-Soluble components | ICP-MS, ICP-AES, AAS, Distillation with steam-IC |
| Elemental analysis-Insoluble component | LIBS, EPMA, TOF-SIMS, XPS, PAR-XPS, XRF, ESR | |
| Distribution-Surface direction(Mapping) | TOF-SIMS, EPMA, SEM-EDX | |
| Distribution-Depth direction(Depth profile) | PAR-XPS, LIBS, TOF-SIMS | |
| Contamination-Deposit in process | ICP-MS, ICP-AES, IC, WTD, TOF-SIMS | |
| Morphological observation/analysis | Surface form | OM, SEM, SEM-EDX, AFM, Laser Microscope |
| Internal structure | STEM, TEM, TEM-EDX, TEM-EELSS, X-ray Microscopy | |
| Elemental state | Chemical bond | Raman, ESR, XPS, PAR-XPS |
| Characteristic evaluation | Optical | Spectral transmittance/reflectance, Infrared spectral transmittance/reflectance, Haze rate |
| Thermal | TMA, TG-DTA, DSC, Thermal conductivity, Thermal shrinkage, Viscosity measurement | |
| Electrical | Ion conductance, Surface resistance, Volume resistance, Insulation resistance, Dielectric characteristics | |
| General Properties | Strain measurement, Specific gravity measurement, Hardness measurement | |
| Deterioration/Weather resistance testing | - | Weather resistance testing, environment testing, chemical durability testing, elution testing |
| Flaws | Foreign object | Raman, FIB-SEM, FIB-TEM, EPMA, XRD, TDS, LIBS, TOF-SIMS, XPS, FT-IR, STEM, TEM, TEM-EDX, TEM-EELS |
| Bubbles | Raman, LIBS, API-MS, X-ray Microscopy | |
| Discoloration | ESR, TOF-SIMS, ICP-MS, XAFS, XPS, Solid-NMR | |
| α-ray | - | Low-level α-ray measurement equipment |
| Extraction・Desoption component | Thermal Desorption(Out gas) -inorganic | API-MS, TG-MS, TPD, TDS, IC, Karl Fischer method |
| Thermal Desorption(Out gas) -organic | TD-GC-MS, WTD-GC-MS, TOF-SIMS, Vacuum Outgas | |
| Liquid extraction(Elution component)-inorganic | ICP-AES, ICP-MS, IC | |
| Liquid extraction(Detachment)-Particle count | LPC | |
| Polishing characteristics | Abrasive・Slurry‐Valuation | ESR |
| Abrasive・Slurry‐Dispersibility | Particle size distribution(Ultrasonic attenuation spectroscopy), Zeta potential(Ultrasonic attenuation spectroscopy), Relaxation time・Affinity with solvent(Pulse-NMR), Hansen solubility parameter(Affinity of powder and liquid) |
|
| Abrasive・Slurry‐Dispersion stability | Dynamic Mechanical. Analysis、Settling velocity, Particle size distribution(Centrifuge settling method) | |
| Abrasive・Slurry-Screening | Resonance ultrasound spectroscopy, Pulse-NMR, Centrifuge settling | |
| Material to be polished－Surface valuation | XPS | |
| Material to be polished-Affinity with liquids | Wettability(Contact Angle), Surface free energy | |
| Material to be polished-Washing residue on surface | ICP-MS, TOF-SIMS, WTD-GC-MS, LPC, IC | |
Technical News
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TN532NEWEvaluation of Gas Adsorption Properties by High-pressure Gas Adsorption Method
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TN462Valence Evaluation of Doped Metal Elements in Glass by ESR
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TN334Chemical Analysis of Metallic Impurities in Fused Silica Materials
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TN051Determination of Ultratrace Impurities using Inductively Coupled Plasma Mass Spectrometry （ICP-MS）
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TN484Precision Measurement of Coefficient of Thermal Expansion (CTE) by High Sensitivity TMA
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TN480Determination of Carbon and Sulfur Content in Solid and Powder Sample
- Infrared Absorption Method after Combustion - -
TN438Evaluation of acidic and basic contaminants using solid active sampler BremS®
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TN425Analysis of Gases Confined in Sealed Space
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TN407Wide Area Mapping of Glass Surface by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
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TN405Qualitative Analysis of Watermarks by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
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TN358Determination of Hydrogen in Zinc Coated Steel Using Thermal Desorption Spectroscopy
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TN342Measurement Method of Volatile Organic Compounds (VOC) Diffused from Automotive Parts
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TN153Cross section analysis of a silica particle by Time of Flight Secondary Ion Mass Spectrometry
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TN050Determination of Inorganic Impurities in Highly Purified Quartz
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TN045Evaluation Methods for Trace Impurities in Clean Room Air
Related Informations
Contact Us for Services
For inquiries and requests concerning services of analysis, measurements, products and consulting, please contact us via inquiry form.