Analysis of minute foreign matter
SCAS performs qualitative analysis by sampling, using our unique sampling technology, contamination and foreign matter which occur in the manufacturing processes for various devices, and inside and outside equipment.
Test Items
By using various techniques such as FIB-TEM/EDX, SCAS investigate foreign materials at nanometer scale as well as micrometer.
| analysis process | equipment |
|---|---|
| Sampling | On-site sampling, non-destructive sampling, μ manipulator |
| Cross section processing | Microtome, precision polishing, CP, FIB, etc. |
| Elemental composition | EPMA、SEM-EDX、AES、XPS、TEM-EDX |
| Qualitative analysis | XPS, TOF-SIMS, AES, micro FT-IR, laser Raman |
Technical News
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TN426Identification of Foreign Matter by Pyrolysis-GC/MS
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TN408Evaluation of Contamination from Outgassing by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
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TN405Qualitative Analysis of Watermarks by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
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TN093Determination of Trace Sulfur and Halogen in Organic Compounds
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TN068Polymer Characterization and Additive Analysis
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TN028Characterization of Fine Substance on Silicon Wafer with Fourier Transform Infrared Microspectrometry（m-FT-IR）
Contact Us for Services
For inquiries and requests concerning services of analysis, measurements, products and consulting, please contact us via inquiry form.