Analysis of minute foreign matter
SCAS performs qualitative analysis by sampling, using our unique sampling technology, contamination and foreign matter which occur in the manufacturing processes for various devices, and inside and outside equipment.
By using various techniques such as FIB-TEM/EDX, SCAS investigate foreign materials at nanometer scale as well as micrometer.
|Sampling||On-site sampling, non-destructive sampling, μ manipulator|
|Cross section processing||Microtome, precision polishing, CP, FIB, etc.|
|Qualitative analysis||XPS, TOF-SIMS, AES, micro FT-IR, laser Raman|
TN426Identification of Foreign Matter by Pyrolysis-GC/MS
TN420Measurement of Oxygen Transmission Rate by Coulometric Method
TN408Evaluation of Contamination from Outgassing by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
TN405Qualitative Analysis of Watermarks by Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)
TN093Determination of Trace Sulfur and Halogen in Organic Compounds
TN068Polymer Characterization and Additive Analysis
TN028Characterization of Fine Substance on Silicon Wafer with Fourier Transform Infrared Microspectrometry（m-FT-IR）